Featured Client for QUSHELL
QuShell, LLC is built on a patent-pending technology for biomimetically engineering a family of new ceramics, each mass-producible in high-throughput at low-cost, out of mineral particles with a strong inter-particle quantum bond-forming quickly at ambient temperature and pressure to impact markets over $Trillions/year.
The QuShell™ ceramics are manufactured by mixing one or several types of powdery minerals (abundant on Earth, Moon, and Mars) into the water, or into an aqueous solution of bio-safe/low-cost nanoparticles or inorganics. By curing the mixture at ambient temperature and pressure within minutes or hours which is tunable, the resultant QuShell(Tm)ceramics can reach the compression strength over 13,000 psi (i.e.~5 times that of high-end types of cement in the market). The curing involves a quantum nano chemical bonding seen typically in seashells and tooth enamel but rarely in lab biomimicry, and newly in the mass-production of the QuShell revolutionary technology.
The QShell® ceramics can be nano-blended with powders, fibers, and sheets of polymeric, glass, and carbon materials to show a wide range of structural ductility, flexibility and plasticity that in many ways surpasses what the seashells and tooth enamels could offer, by design.
The QShell® ceramics can be coated on solids (e.g. metals, polymers, glass, ceramics, concretes, carbon fibers) for resisting corrosion, erosion, photobleaching, flaming, oxidation, scratch, indentation, and oil’s/water’s penetration, dissolution, and swelling.
The QuShell® ceramics are ideal for making surface and underground habitats and transportation-related infrastructures on Earth, Moon and Mars, and for revolutionizing on-Earth infrastructures e.g. highways, bridges, tunnels, skyscrapers, pipelines, fireproof and bulletproof wall panels and arena tops pre-integrated/packaged with AI, IoT, IC chips, sensors, batteries, super-capacitors, to name but a few.
III. QuShell® Versatilities:
- To package ICs/nanochips for quantum computing, 5G communication, power control, and space-electronics, because
- the alloys or polymers in nowadays IC-packaging have thermal expansion coefficients very different from that of a silicon wafer substrate, which can crack/fail the ICs/nanochips after cycles of heating/cooling when using thus-packed devices;
- the Low-Temperature Cured Ceramics (LTCC, as the commercially available new packaging tech) needs to be cured at 850 oC at which the nanochips can be damaged by the heat.
- To replace conventional types of cement for gaining 5X stronger mechanical strength, one third lighter and one third the cost, and with zero carbon footprint;
- To offer the unusual flexibility/ductility/durability, contrasting ordinary ceramics and types of cement, for scalable 3D-printing, extrusion, and molding of flexible/strong/shock-resisting components and bodies far stronger and lighter, in high throughput/reproducibility and zero carbon-footprint, for automotive, locomotive, ship tank, aerospace, defense, homeland security, and oil and natural gas.